標題: Titlebook: 3D Integration for NoC-based SoC Architectures; Abbas Sheibanyrad,Frédéric Pétrot,Axel Jantsch Book 2011 Springer Science+Business Media, [打印本頁] 作者: 法官所用 時間: 2025-3-21 20:06
書目名稱3D Integration for NoC-based SoC Architectures影響因子(影響力)
書目名稱3D Integration for NoC-based SoC Architectures影響因子(影響力)學(xué)科排名
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書目名稱3D Integration for NoC-based SoC Architectures網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱3D Integration for NoC-based SoC Architectures被引頻次
書目名稱3D Integration for NoC-based SoC Architectures被引頻次學(xué)科排名
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書目名稱3D Integration for NoC-based SoC Architectures年度引用學(xué)科排名
書目名稱3D Integration for NoC-based SoC Architectures讀者反饋
書目名稱3D Integration for NoC-based SoC Architectures讀者反饋學(xué)科排名
作者: 仇恨 時間: 2025-3-21 21:18
Three-Dimensional Integration of Integrated Circuits—an Introduction like conquering cross-platform issues, countering potential security holes, and testing and debugging JavaScript with efficiency. All examples are based on real-world scenarios, so you‘ll be able to apply what you learn to your own development situations..978-1-59059-667-8978-1-4302-0253-0作者: Nucleate 時間: 2025-3-22 02:43 作者: 來就得意 時間: 2025-3-22 05:40
Three-Dimensional Networks-on-Chip: Performance Evaluationd colorful abstract graphics and particles. . .After reading and using this book, you‘ll be able to build your first 3D Android game app for smartphones and tablets.? You may even be able to upload and sell fro978-1-4302-6547-4978-1-4302-6548-1作者: chemoprevention 時間: 2025-3-22 11:01 作者: SLUMP 時間: 2025-3-22 16:06 作者: 埋伏 時間: 2025-3-22 21:02
Zening Wang,Yungong Sun,Liang Liu,Ao Lins are already available or emerging. It provides an overview of the manufacturing steps of TSV-based 3D-SICs, as far as relevant for testing. Subsequently, it discusses flows for wafer-level and package-level tests, the challenges with respect to test contents and wafer-level probe access, and the 作者: 是突襲 時間: 2025-3-22 21:34
Like Zhang,Wenjing Kang,Guangdong Zhangemperature-aware models that incorporate the power consumed by the processing elements of the network in addition to the power of the network links and switches. A methodology that includes these models is employed to determine the interconnect architecture within the PEs in each physical plane of a作者: Fibrinogen 時間: 2025-3-23 04:23
6GN for Future Wireless Networkser performance, functionality, and packaging density compared to more traditional planar ICs. On the other hand, NoC is an enabling solution for integrating large numbers of embedded cores in a single die. 3D NoC architectures combine the benefits of these two new domains to offer an unprecedented p作者: 聯(lián)想 時間: 2025-3-23 05:35 作者: MAOIS 時間: 2025-3-23 10:52
https://doi.org/10.1007/978-3-031-36249-1V) vertical interconnection technology, which is emerging as the most promising technology enabler for 3D integration. We then present methodologies and tools for automated 3D interconnect design, focusing on application-specific NoC synthesis for 3D ICs. 3D-NoC synthesis consists of finding the bes作者: nutrients 時間: 2025-3-23 15:35 作者: 停止償付 時間: 2025-3-23 19:49 作者: anus928 時間: 2025-3-24 01:58 作者: 外向者 時間: 2025-3-24 02:22 作者: 軌道 時間: 2025-3-24 09:08
Physical Analysis of NoC Topologies for 3-D Integrated Systemsvelopment kit. Author, Android columnist, developer, and community advocate .Mark L. Murphy. will show you what you need to know to get started programming Android applications, including how to craft graphical user interfaces, use GPS, multi-touch, multi-tasking, and access web services.. .978-1-4302-3297-1978-1-4302-3298-8作者: 藝術(shù) 時間: 2025-3-24 14:14
the tools and compiling a skeleton app. Move through creating layouts, employing widgets, taking user input, and giving back results. Soon you’ll be creating innovative applications involving multi-touch, multi-tasking, location-based feature sets using GPS. .You’ll be drawing data live from the In作者: 傾聽 時間: 2025-3-24 15:16
Design of Application-Specific 3D Networks-on-Chip Architecturess a treadmill which transmitted data to a connected Android device and a huge tilt labyrinth, which could be controlled with an Android device. Shortly after the event, the first DIY projects surfaced which already showed the great potential of the ADK.作者: elucidate 時間: 2025-3-24 22:36
3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stackses contained in this book include building a game engine, writing a renderer, and building a full game app with entities, game levels and collisions. As part of the tutorial you‘ll also learn about inserting perspectives using cameras and including audio in your game app. .978-1-4302-5830-8978-1-4302-5831-5作者: Overstate 時間: 2025-3-25 01:25
Influence of Stacked 3D Memory/Cache Architectures on GPUs scratch, based on Canvas API and OpenGL ES.Create a full-featured 3D game.Publish your games, get crash reports, and support your users.Complete your own playable 2D OpenGL games.Who This Book Is For.People with a basic knowledge of Java who want to write games on the Android platform. It also offe作者: Muscularis 時間: 2025-3-25 06:27 作者: Lamina 時間: 2025-3-25 07:48
gh quality designs and interactive prototypes of web sites and mobile apps using?Adobe XD‘s powerful drawing and layout tools. This book.?.provides an in-depth look at XD and shows you how to quickly get up-to-speed to simplify these processes with intuitive design tools and a powerful prototyping f作者: Visual-Acuity 時間: 2025-3-25 11:56 作者: staging 時間: 2025-3-25 18:50
The Promises and Limitations of 3-D Integratione.js applications in Amazon Web Services. Hosting a Node.js application in a production environment usually means turning to PaaS hosting, but this approach brings problems. Deploying Node.js directly to AWS solves the problems you encounter in these situations, enabling you to cut out the middle ma作者: POWER 時間: 2025-3-25 21:10
or and Android columnist, writer, developer, and community advocate .Mark L. Murphy. shows you what you need to know to get started on programming Android applications–everything from crafting graphical user interfaces to using GPS, accessing web services, and more!. .The Android development platfor作者: Frenetic 時間: 2025-3-26 02:11 作者: 禁止 時間: 2025-3-26 07:13
Physical Analysis of NoC Topologies for 3-D Integrated Systems with your copy of the software development kit.The vibrant and rich Android development platform, created by Google and the Open Handset Alliance, continues to be a platform in its truest sense, encompassing hundreds of classes beyond the traditional Java classes and open source components that shi作者: 重畫只能放棄 時間: 2025-3-26 09:28 作者: 悲觀 時間: 2025-3-26 16:40 作者: –scent 時間: 2025-3-26 19:48
Asynchronous 3D-NoCs Making Use of Serialized Vertical Linksworld‘s leading mobile platform, according to Gartner.Beginning Android 4 Games Development .offers everything you need to join the ranks of successful Android game developers. You‘ll start with game design fundamentals and programming basics, and then progress toward creating your own basic game en作者: 演講 時間: 2025-3-26 23:58
Design of Application-Specific 3D Networks-on-Chip Architecturesion to improvements in its already well-known technologies such as the Google APIs or the core search technology, Google placed the focus on two major themes: Chrome and Android. As always, the newest advances in the Android Platform were presented and discussed, but what Google announced a bit late作者: 是他笨 時間: 2025-3-27 04:25 作者: 散開 時間: 2025-3-27 06:33 作者: cogitate 時間: 2025-3-27 12:00 作者: adequate-intake 時間: 2025-3-27 16:38
Back MatterAndroid and gaming are key tech and book markets..Beginning Android Games, Second Edition .offers everything you need to join the ranks of successful Android game developers, including Android tablet game app development considerations.? You‘ll start with game design fundamentals and programming bas作者: 原始 時間: 2025-3-27 21:05 作者: Anticoagulants 時間: 2025-3-28 01:42
Integrated Circuits and Systemshttp://image.papertrans.cn/012/image/100738.jpg作者: CON 時間: 2025-3-28 03:42 作者: 頑固 時間: 2025-3-28 08:58
978-1-4614-2748-3Springer Science+Business Media, LLC 2011作者: Foolproof 時間: 2025-3-28 11:51
3D Integration for NoC-based SoC Architectures978-1-4419-7618-5Series ISSN 1558-9412 Series E-ISSN 1558-9420 作者: 不要嚴酷 時間: 2025-3-28 15:38 作者: 放肆的我 時間: 2025-3-28 21:43
Signals and Communication Technology space of the system as well as some empirical results that quantify the expected performance gain of such a system. Also, the chapter discusses the cost, power and thermal aspects of the proposed designs.作者: chassis 時間: 2025-3-29 00:18
Conference proceedings‘‘‘‘‘‘‘‘ 2023functional diversification. 3D integration offers a long list of benefits in terms of system form factor, density scaling and multiplication, reduced interconnection latency and power consumption, bandwidth enhancement, and heterogeneous integration of disparate technologies. In this 3D implementati作者: Corroborate 時間: 2025-3-29 03:24 作者: 流眼淚 時間: 2025-3-29 09:55 作者: 能得到 時間: 2025-3-29 14:58 作者: Substance-Abuse 時間: 2025-3-29 16:29
6GN for Future Wireless Networksin a single die. The achievable performance benefit arising out of adopting NoCs is constrained by the performance limitation imposed by the metal wire, which is the physical realization of communication channels. With technology scaling, only depending on the material innovation will extend the lif作者: TIGER 時間: 2025-3-29 22:00
https://doi.org/10.1007/978-3-031-36014-5hip systematically tackles this physical issue by differentiating between local and global interconnects, 3D-Integration by folding the die into multiple layers and using short vertical links instead of long horizontal interconnects, leads to a considerable reduction in the length and the number of 作者: 十字架 時間: 2025-3-29 23:53
Zheqing Tang,Xiqiang Sun,Yang Luothe prospect of extending emerging Systems-on-Chip (SoC) design paradigms based on Networks-on-Chip (NoC) interconnection architectures to 3D chip designs. In this chapter, we consider the problem of designing application-specific 3D-NoC architectures that are optimized for a given application. Both
